Keywords
photolithography technology, Key core technologies, Technological competition situation, patent data
Abstract
By analyzing the patent data of lithography technology included in the Derwent Innovation, this paper discusses the technology competition situation of global photolithography technology from three aspects: the overall patent environment, technology layout and institutional competition. The results show that the number of global photolithography technology patents is still in a stable growth stage. China’s photolithography technology has been highly active in technology research and development in recent years, but there is still a big gap compared with the United States and Japan, which have strong original technology accumulation. The research focus is divergent distribution around the extreme ultraviolet lithography technology; Globally, the internal agglomeration of scientific research activities of institutions in various countries is obvious, and external technical barriers are set up by Japan, the United States and other technology leading countries, forming a local technology lock. Therefore, in the field of lithography, China should seize the opportunity of technological transformation, keenly grasp the technological development trend to advance the layout, pay attention to both basic research and application development, and build a new cooperative organization and governance mechanism that focuses on domestic cooperation and is supplemented by international cooperation. Focus on domestic cooperation and expand new ideas for cooperation with foreign institutions.
DOI
10.16315/j.stm.2023.01.003
Recommended Citation
WU, Jian-long; HU, Jiang-rong; BAO, Meng-meng; and WANG, Jin
(2023)
"Research on the global competition of photolithography technology based on patent data,"
Journal of Science and Technology Management: Vol. 25:
Iss.
1, Article 1.
DOI: 10.16315/j.stm.2023.01.003
Available at:
https://jstm.researchcommons.org/journal/vol25/iss1/1
Creative Commons License
This work is licensed under a Creative Commons Attribution-NonCommercial-No Derivative Works 4.0 International License.